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Product Type:Â Solder Wire
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Alloy Composition:Â 60% Tin (Sn), 40% Lead (Pb) –Â DS6+M60
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Flux Type:Â No-Clean Rosin (RMA) Flux
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Flux Content:Â Typically between 1.8% – 2.2% by weight (Core percentage may vary slightly by manufacturer)
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Wire Diameter:Â 0.4mm (0.016 inches)
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Net Weight:Â 40 grams (0.04 kg)
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Melting Temperature: Approximately 183°C – 190°C (361°F – 374°F)
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Application:Â Precision electronics, SMD components, mobile phone repair, circuit board rework, DIY projects.
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Packaging:Â Typically supplied on a small, plastic reel with a label.
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Standards:Â Conforms to common industry standards for solder wire (e.g., J-STD-006).
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Product Type:Â Solder Wire
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Alloy Composition:Â 60% Tin (Sn), 40% Lead (Pb) –Â DS6+M60
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Flux Type:Â No-Clean Rosin (RMA) Flux
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Flux Content:Â Typically between 1.8% – 2.2% by weight (Core percentage may vary slightly by manufacturer)
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Wire Diameter:Â 0.4mm (0.016 inches)
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Net Weight:Â 40 grams (0.04 kg)
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Melting Temperature: Approximately 183°C – 190°C (361°F – 374°F)
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Application:Â Precision electronics, SMD components, mobile phone repair, circuit board rework, DIY projects.
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Packaging:Â Typically supplied on a small, plastic reel with a label.
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Standards:Â Conforms to common industry standards for solder wire (e.g., J-STD-006).
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Brand: Mechanic
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Model: 900M-T-SK
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Type: Lead-Free Soldering Iron Tip
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Material: Copper core with iron plating
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Tip Shape: Beveled/Skewed
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Compatibility: 936 / 937 / 898D / 852D+ soldering stations (and other 900M supported irons)
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Application: Jumper wire soldering, BGA repair, motherboard work, micro-soldering
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Brand: Mechanic
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Model: 900M-T-SK
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Type: Lead-Free Soldering Iron Tip
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Material: Copper core with iron plating
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Tip Shape: Beveled/Skewed
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Compatibility: 936 / 937 / 898D / 852D+ soldering stations (and other 900M supported irons)
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Application: Jumper wire soldering, BGA repair, motherboard work, micro-soldering
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Brand: Mechanic
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Model: 900M-T-I
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Type: Lead-Free Soldering Iron Tip
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Shape: Conical (I-type)
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Compatibility: 900M series soldering irons
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Application: Jumper wire soldering, BGA rework, motherboard repair, SMD/PCB soldering
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Brand: Mechanic
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Model: 900M-T-I
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Type: Lead-Free Soldering Iron Tip
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Shape: Conical (I-type)
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Compatibility: 900M series soldering irons
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Application: Jumper wire soldering, BGA rework, motherboard repair, SMD/PCB soldering
5 day delivery -
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Brand: Mechanic
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Model: Tin V5B45
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Type: Soldering Flux Paste / Welding Cream
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Weight: 42g
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Applications: PCB repair, SMD/BGA rework, jumper wire soldering, phone motherboard repair
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Function: Prevents oxidation, improves solder flow, ensures reliable joints
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Product ConfigurationÂ
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Tool Compatibility: Ensure the blade matches your degumming tool’s model (e.g., blade dimensions, attachment mechanism).
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Installation:
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Unplug the tool and let it cool completely.
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Remove the old/worn blade by loosening the retention screw or clip.
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Insert the new blade securely and tighten the screw.
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Operation:
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Plug in the tool and allow it to heat to the recommended temperature.
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Gently scrape residues at a 30-45 degree angle to avoid surface scratches.
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Safety:Â Wear heat-resistant gloves during blade changes and operation.
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Add to cartProduct ConfigurationÂ
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Tool Compatibility: Ensure the blade matches your degumming tool’s model (e.g., blade dimensions, attachment mechanism).
-
Installation:
-
Unplug the tool and let it cool completely.
-
Remove the old/worn blade by loosening the retention screw or clip.
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Insert the new blade securely and tighten the screw.
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Operation:
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Plug in the tool and allow it to heat to the recommended temperature.
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Gently scrape residues at a 30-45 degree angle to avoid surface scratches.
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Safety:Â Wear heat-resistant gloves during blade changes and operation.
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Product Configuration
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Surface Prep:Â Ensure metal surfaces are clean and free of gross debris.
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Application:Â Use the built-in brush or dropper to apply a thin layer of flux to the joint area.
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Soldering:Â Proceed with heating and soldering as usual; the flux will activate and clear oxides.
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Cleaning:Â After soldering, clean any residue with isopropyl alcohol, water, or a dedicated flux cleaner (check flux type).
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Storage:Â Keep bottle tightly closed and store in a cool, dry place.
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Add to cartProduct Configuration
-
Surface Prep:Â Ensure metal surfaces are clean and free of gross debris.
-
Application:Â Use the built-in brush or dropper to apply a thin layer of flux to the joint area.
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Soldering:Â Proceed with heating and soldering as usual; the flux will activate and clear oxides.
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Cleaning:Â After soldering, clean any residue with isopropyl alcohol, water, or a dedicated flux cleaner (check flux type).
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Storage:Â Keep bottle tightly closed and store in a cool, dry place.
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Product Type: High Sensitivity Mini CCTV Microphone
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Coverage Area: 50–150 square meters
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Compatibility: 1080p WiFi IP cameras, DVRs, and surveillance systems
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Audio Output: Stable signal for DVR/camera input
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Design: Mini, discreet & lightweight
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Installation: Easy plug-and-play with CCTV system
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Applications: Homes, offices, shops, banks, classrooms, and warehouses
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Product Type: High Sensitivity Mini CCTV Microphone
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Coverage Area: 50–150 square meters
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Compatibility: 1080p WiFi IP cameras, DVRs, and surveillance systems
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Audio Output: Stable signal for DVR/camera input
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Design: Mini, discreet & lightweight
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Installation: Easy plug-and-play with CCTV system
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Applications: Homes, offices, shops, banks, classrooms, and warehouses
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Product ConfigurationÂ
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Software Installation:Â Install the TL866CS software on a Windows PC.
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Connect Hardware:Â Plug the programmer into USB and ensure drivers are loaded.
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Select Chip: Choose the target IC model from the software’s database.
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Insert IC:Â Open the ZIF socket, place the chip correctly (align pin 1), and close the socket.
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Operations:
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Read:Â Extract firmware and save as a backup file.
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Write:Â Load a .bin/.hex file and program the chip.
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Erase:Â Clear chip contents before writing new data.
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Safety:Â Always handle chips statically safe and power off when inserting/removing.
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Add to cartProduct ConfigurationÂ
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Software Installation:Â Install the TL866CS software on a Windows PC.
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Connect Hardware:Â Plug the programmer into USB and ensure drivers are loaded.
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Select Chip: Choose the target IC model from the software’s database.
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Insert IC:Â Open the ZIF socket, place the chip correctly (align pin 1), and close the socket.
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Operations:
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Read:Â Extract firmware and save as a backup file.
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Write:Â Load a .bin/.hex file and program the chip.
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Erase:Â Clear chip contents before writing new data.
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Safety:Â Always handle chips statically safe and power off when inserting/removing.
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