Product Configuration

This is a consumable material and does not have “configuration” in the electronic sense. However, correct usage is critical:

1. Identify the Alloy: Check the product label to confirm the alloy type (e.g., Sn60Pb40 or Sn99Cu0.7Cu). This determines the melting temperature and application.

• Sn60Pb40 (Leaded): Melts at ~183-190°C. Easier to use, shinier joints.

• Sn99Cu1 (Lead-Free): Melts at ~227°C. Requires higher temperature, joints are duller.

2. Check the Diameter: The spool will have a specific diameter (e.g., 1.0mm, 0.8mm). Choose the right diameter for your work:

• Thicker (1.0mm+): Better for large wires, connectors, and through-hole components.

• Thinner (0.5-0.8mm): Ideal for precision electronics and surface-mount components.

3. Use with Appropriate Equipment:

• Temperature Setting: Set your soldering iron temperature according to the alloy. For lead-free, a higher temperature (320-380°C) is needed.

• Iron Tip: Use a clean, properly tinned tip that is large enough to transfer heat efficiently for the size of the joint.

4. Standard Soldering Technique:

• Heat the joint (both the component lead and the PCB pad) with the iron tip.

• Apply the solder wire to the joint, not directly to the iron. The heated joint should melt the solder, allowing it to flow smoothly.

• Use the flux core to your advantage—the solder should flow easily if the surfaces are clean and hot enough.

Warning: Always work in a well-ventilated area. The fumes produced from soldering, especially from the flux, are irritants and should not be inhaled.