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Mechanic Ds6+m60 40g 0.4mm Electronic Soldering Welding No-clean Rosin Solder Wire

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  • Product Type: Solder Wire

  • Alloy Composition: 60% Tin (Sn), 40% Lead (Pb) – DS6+M60

  • Flux Type: No-Clean Rosin (RMA) Flux

  • Flux Content: Typically between 1.8% – 2.2% by weight (Core percentage may vary slightly by manufacturer)

  • Wire Diameter: 0.4mm (0.016 inches)

  • Net Weight: 40 grams (0.04 kg)

  • Melting Temperature: Approximately 183°C – 190°C (361°F – 374°F)

  • Application: Precision electronics, SMD components, mobile phone repair, circuit board rework, DIY projects.

  • Packaging: Typically supplied on a small, plastic reel with a label.

  • Standards: Conforms to common industry standards for solder wire (e.g., J-STD-006).

  • Alloy: High-quality DS6+M60 (60% Tin, 40% Lead) for a strong, reliable bond with a low melting point.

  • Core: No-clean rosin (RMA) flux core for effortless soldering and no sticky residue.

  • Diameter: 0.4mm (0.016″), ideal for precision electronics, SMD components, and fine-pitch ICs.

  • Weight: Economical 40g roll, perfect for hobbyists, technicians, and repair work.

  • Finish: Creates shiny, smooth, and conductive solder joints.

This DS6+M60 40/60 tin-lead solder wire is engineered for electronic soldering applications where precision and reliability are paramount. The 0.4mm diameter makes it exceptionally suitable for detailed work on modern circuit boards, including surface-mount devices (SMD), small connectors, and fine-pitch integrated circuits without the risk of bridging closely spaced pins. Its core is filled with a no-clean rosin (RMA) flux, which actively removes oxidation from metal surfaces during the soldering process, ensuring excellent wetting and strong intermetallic bonds. The key advantage of the “no-clean” flux formula is that the light residue left behind is non-corrosive, non-conductive, and does not require cleaning for most applications, saving significant time and effort in the assembly process. This solder wire melts easily and flows smoothly, resulting in strong, shiny, and highly reliable solder joints every time.

  • Precision Application: The ultra-thin 0.4mm diameter provides exceptional control over solder quantity, preventing bridges and shorts on delicate components.

  • No-Clean Flux Core: The rosin flux core ensures a clean soldering process with minimal, harmless residue that does not need to be washed off, making it perfect for rework and repair.

  • Excellent Wetting: The flux promotes superior flow and adhesion of the solder to component leads and PCB pads, creating strong and durable connections.

  • Smooth & Shiny Joints: Produces high-quality, aesthetically pleasing solder joints that are indicative of a good connection.

  • Reliable Alloy: The 60/40 tin-lead ratio offers a well-defined eutectic point, meaning it solidifies quickly, reducing the risk of cold joints.

  • Convenient Spool: The 40g roll is easy to handle and store, making it a practical choice for professionals and hobbyists alike.

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